Intel And Tower Semiconductor Forge $300 Mln Foundry Partnership
(RTTNews) - Intel Foundry Services and Tower Semiconductor (TSEM) have entered a significant partnership, with Intel offering its advanced 300 mm manufacturing capabilities to support Tower Semiconductor's global expansion. Tower Semiconductor will invest up to $300 million to acquire equipment for Intel's New Mexico facility, creating a capacity corridor capable of handling over 600,000 photo layers monthly for advanced 300 mm analog processing.
This collaboration underscores the commitment of both companies to expand their foundry operations, leveraging Intel's renowned manufacturing expertise. Tower Semiconductor's specialized 65-nanometer power management BCD flows will be produced at Intel's Fab 11X facility in New Mexico.